Miller MMIC, renowned for its extensive portfolio of RF and microwave integrated circuit (MMIC) bare die products, has announced the introduction of QFN packaging options for both ceramic and plastic enclosures. This new offering caters to a variety of applications across industries, providing greater flexibility and enhanced performance.
With hundreds of RF MMIC bare die products already in its catalog, Miller MMIC’s expansion into QFN (Quad Flat No-lead) packaging is a significant step toward meeting the needs of customers requiring robust and scalable solutions. The QFN ceramic packages offer higher thermal conductivity, making them ideal for high-power applications, while plastic packages provide a cost-effective solution for consumer electronics and lower-power applications.
“By offering both ceramic and plastic QFN packages, we aim to deliver tailored solutions for different applications, from defense and aerospace to commercial and industrial sectors,” said Miller MMIC’s packaging engineering director
This development underscores Miller MMIC's commitment to providing end-to-end solutions for its clients, enabling more versatile integration of their MMIC products into diverse systems.
